According to the survey, with the Taiwan-based chipset vendor master positive into the market by price war, and the Renesas chip prices would appear that most of next year's new models will be equipped with usb 3.0 front panel interface. At the same time this year, Intel also announced that it will include USB 3.0 reference design, the processor manufacturers to promote the circumstances, DRAMeXchange that, USB 3.0 Host end of next year maturity and is expected to significantly increase penetration.
U disk from the application point of view, USB 3.0 transfer speed USB 2.0 is about two to about three times, the mainstream capacity also increase from the current stage of the 4GB to 8GB or more, while the external hard drive transfer rate and more good value for money (both 500GB capacity next year off) is also favored by consumers. Therefore DRAMeXchange believes that consumers with high-capacity file transfer needs of high-definition video files in the USB 3.0 will effectively be driven environment, will also increase joint NAND Flash U disk usage for the demand, so the popularity of USB 3.0 rate U disk market will be next year a major focus of observation.
DRAMeXchange that mature in product prices and cost reduction under the incentive speed, USB 3.0 desktop and notebook computers in the penetration rate in 2011 is expected to reach 60%, respectively, and 50% or more, if the price cut and the peripheral chip prices Products with the degree to accelerate the rate of increase, the opportunity to further increase penetration.
The forward to 2012, in both Intel and AMD chips into built-in USB3.0, the popularity of will, as the existing USB2.0. In addition to PC-side applications while outside, DRAMeXchange also found with the consumer electronics and home appliances gradually into the concept of digital design, the consistency of the interface for the transmission interconnection with the device of increasing demand, so USB 3.0 will have the opportunity to import other non- PC class consumer electronic devices.
